International collaboration EU and Japan on semiconductors
Expected Outcome: Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry
The official English text of the call comes from the European Commission's Funding & Tenders portal.
Deadline
8 December 2026 45 days left
Grant per project
3–5 million EURTotal budget: 5 million EUR · about 2 funded projects
Region
International (EU)
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Eligibility criteria
EU direct call: eligibility depends mainly on the consortium, the participants' countries and their types of organisation. We cannot check these from your company details, so we do not tell you whether you are eligible. The criteria are in the official call.
Official callQuestions about this call?
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Official description
Expected outcome and scope
Expected Outcome: Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry. Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.
Eligibility and submission conditions
"> Conditions 1. Admissibility conditions: Proposal page limit and layout described in Appendix 8 of Work Programme - Chips for Europe Initiative call document . Proposal page limits and layout: described in Part B of the Application Form available in the Submission System. 2. Eligible countries described in Appendix 8 of Work Programme - Chips for Europe Initiative . 3. Other eligibility conditions Appendix 8 of Work Programme - Chips for Europe Initiative . 4. Financial and operational capacity and exclusion described Appendix 8 of Work Programme - Chips for Europe Initiative . 5a. Evaluation and award: Submission and evaluation processes described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual . 5b. Evaluation and award: Award criteria, scoring and thresholds described Appendix 8 of Work Programme - Chips for Europe Initiative . 5c. Evaluation and award: Indicative timeline for evaluation and grant agreement described in Appendix 8 of Work Programme - Chips for Europe Initiative . 6. Legal and financial set-up of the grants described Appendix 8 of Work Programme - Chips for Europe Initiative . Call Details Call document and annexes: Model Grant Agreements (MGA) DEP MGA Additional documents: DEP Regulation 2021/964 EU Financial Regulation 2024/2509 EU Grants AGA — Annotated Model Grant Agreement Funding & Tenders Portal Online Manual Funding & Tenders Portal Terms and Conditions Funding & Tenders Portal Privacy Statement
Hivatkozott dokumentumok
Online Manual DEP MGA EU Grants AGA — Annotated Model Grant Agreement Funding & Tenders Portal Terms and Conditions
Grant writers send you a quote — free, and with no obligation.1 expert takes on calls like this →
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Deadline · 45 days left
8 December 2026